GKzhan Abstract: China's sensor technology and products have been greatly improved after the development. There are more than 1,600 enterprises and institutions in the country engaged in sensor research, development and production. However, compared with foreign countries, China's sensor product varieties and quality levels are still unable to meet the needs of the domestic market, and the overall level is still at the level of foreign countries in the early 1990s. The main problems that exist are:

(1) Poor scientific and technological innovation, the core manufacturing technology lags far behind that of foreign countries, there are few products with independent intellectual property rights, and the varieties are not complete, and the product technology level is different from that of foreign countries by about 15 years.

(2) The investment intensity is low, the research equipment and production technology equipment are backward, the achievement level is low, and the product quality is poor.

(3) The disconnect between science and technology and production, affecting the transformation of scientific research results, the overall strength is relatively low, and the potential for industrial development is insufficient.

Strategic Objectives By 2012, the sensor field should strive to achieve three strategic goals:

--- Focusing on industrial control, automotive, communications, and environmental protection as the key service areas, focusing on sensors, flexible components, optical components, and special circuits, and developing original technologies and products with independent intellectual property rights;

--- Based on MEMS technology, relying on integrated, intelligent and networked technologies to strengthen the manufacturing process and the development of new sensors and instrumentation components, leading the leading products to reach and reach the advanced level of similar foreign products;

---In order to increase variety, improve quality and economic efficiency as the main goal, accelerate the industrialization, so that the domestic sensor occupancy rate of the species reached 70% to 80%, up to 60% of high-end products.

2012 Sensor Development Key Sensor Technology (1) MEMS Process and Next-Generation Solid State Sensor Microstructure Manufacturing Process: Deep Reactive Ion Etching (DRIE) Process or IGP Process; Packaging Process: such as Normal Temperature Bonding, Flip-Flop, No-Stress Micro-Thin Structure Packaging, multi-chip assembly process; new sensors: such as micro-silicon capacitive sensors, micro-silicon mass flow sensors, aerospace dynamic sensors, micro-sensors, automotive pressure, acceleration sensors, environmental protection micro-chemical sensors.

(2) Integrated process and multivariable composite sensor microstructure integrated manufacturing process; Multivariable composite sensors for industrial control, such as: pressure, static pressure, temperature three-variable sensors, pressure, wind, temperature, humidity four-variable sensors, micro silicon composite Strain pressure sensor, display sensor.

(3) Intelligent technology and intelligent sensor signals Wired or wireless detection, conversion processing, logic judgment, function calculation, two-way communication, self-diagnosis and other intelligent technologies; smart multivariable sensors, smart power sensors and various smart sensors, transmission Device.

(4) Networked technology and networked sensor sensor networking technology; Networked sensors enable the sensor to have industrial standard interface and protocol functions.