Existing problems and prospects With the application of high-power electronic components in the fields of national defense, aerospace, electronic information and modern CNC machining, the requirements for heat sink heat sink materials are becoming more and more demanding. Diamond/copper-based composite materials, as one of the new generation of heat-dissipating materials for high-power electronic equipment hotspots, how to play the characteristics of each component of diamond/copper-based composite materials, so that the new heat-dissipating materials can achieve high thermal conductivity and low thermal expansion. The coefficient is the main problem currently existing: (1) the compactness of diamond and copper. This is because the wettability of diamond and copper is poor. There is no solid phase reaction between the two at 1150 °C, which cannot be directly from the sintering. Get a dense composite. At present, researchers mainly modify the surface of diamonds, such as adding interface elements (Mo, Cr, B, Ti, etc.) to improve the interface compatibility between diamond and copper, and reduce the interface thermal resistance; (2) diamond graphitization problem, diamond During the vacuum sintering process with copper, when the temperature is between 970 and 1670K, some diamonds begin to graphitize. Once the temperature is higher than 2070K, the diamond is completely graphitized, which is related to the sintering atmosphere and sintering pressure. Therefore, sintering under atmosphere protection, avoiding contact with air, can inhibit the generation of graphitization; (3) performance problems of diamond/Cu-based composite materials under thermal cycling load conditions, when preparing high-performance diamond/Cu-based composite materials Large particles and high volume fraction of diamond particles are often used, which will inevitably lead to an increase in internal stress distortion of the composite. Under the condition of thermal cycle load conditions for a long time, the diamond/copper-based composite material Performance changes such as thermal conductivity, distortion stress field, elastic modulus and creep. For the future development of diamond/copper-based composite materials, research should be carried out from the following aspects: (1) Study on particle surface modification process and matrix alloy design ideas, establish the physical property matching rules between transition layer and diamond and copper, and find The optimal transition layer is used to improve the interface bonding and interfacial thermal resistance between diamond and copper, so as to further improve the thermophysical properties and mechanical properties of the composite. (2) By continuously researching and innovating advanced preparation techniques, it is the mainstream direction of future research to prepare highly dense and uniformly dispersed diamond/copper-based composite heat-dissipating materials. (3) Diamond composite materials are difficult to process. Therefore, it is necessary to further develop and improve the low-cost “powder injection molding? melt immersion†near-net forming manufacturing technology, and realize the wide application of diamond/copper composite materials as heat-dissipating materials in the electronics industry. (Finish) Product categories of Graduation Honor Cords, we are specialized manufacturers from China, Graduation Honor Cords, Graduation Honor Cords suppliers/factory, wholesale high-quality products of Graduation Honor Cords R & D and manufacturing, we have the perfect after-sales service and technical support. Look forward to your cooperation!Welcome to purchase! Curtain Tassel Fringe,curtain holdbacks & tassels,tassel tie backs,tassel tie backs for curtains,tassels and tiebacks Eternity International Trading Co;Ltd , https://www.e-tygroup.com